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The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
B Recommended temperature profile
250
250?(PEAK)
220?
200
150
150?
170?
100
50
60~120s
60s(MAX)
25?
0
START
Time (Seconds)
q Recommended conditions
? Reflow system: IR reflow
? Solder composition: Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Flux content 10.5wt%)
? Test board: Glass epoxy 80mm∞125mm∞1.6mm thick
? Metal mask: 0.15mm thick
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations.
A68
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